Enhancing IoT Chip Security: Multi-Layer Shielding Against Electromagnetic Side Channel Attacks
Open Access DepositedThe World Economic Forum’s (WEF) 2024 Global Risk Report suggests that 75.4 billion devices will be connected to the Internet by 2024. The WEF report estimated that cyber insecurity would be the 4th most likely to impact risk against civilization before interstate armed conflicts severely in two years (Hodgdon, 2021; WEF, 2024). The predominantly neglected hardware security of most connected devices, including ubiquitous laptops, wearables, smartphones, drones, and even electric vehicles, also known as the Internet of Things (IoT), has unintentionally given rise to diverse information vulnerabilities since the early 1960s (Anderson, 2019). A significant avenue of this unintentional data transmission is the side channel (SC), a medium through which sensitive information leaks, endangering user privacy and rendering it susceptible to side-channel attacks (SCA). This compromise of data privacy and integrity raises concerns and incurs substantial financial repercussions, often reaching multi-billion dollars in scale (Anderson, 2019; Bhunia & Tehranipoor, 2019; MITRE, 2018; Paul, 1992). Despite extensive research into emerging SCAs and countermeasure applications, recent years have witnessed the emergence of Generative Artificial Intelligence (AI) driven and adversarial machine learning side-channel attacks (SCA) (Anderson, 2019; Bhunia & Tehranipoor, 2019; Buhan, Batina, Yarom, & Schaumont; Picek, Perin, Mariot, Wu, & Batina, 2021). These new attack tools provide attackers with enhanced performance and heightened capabilities, setting them apart from alternative techniques. In this context, this praxis comprehensively explores Electromagnetic (EM) side-channel (SC) vulnerabilities within the IoT paradigm and highlights inherent vulnerabilities at the hardware level by evaluating existing prevention applications. The praxis introduces a novel multi-layer shielding application for IoT security against electromagnetic side-channel attacks (EM SCA) with over 98.9% EM emanation reduction at the chip level. It makes a chip almost invisible based on MATLAB Simulink results. Multi-layer security encompasses active signal-eliminating standing EM wave generation with multiple passive physical layer applications underlying the imperative of robust data privacy safeguards without requiring financial burdens and time-consuming new development and manufacturing processes for the manufacturer and the end user.
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