Emerging Material Integration and Metrology for Ultra-Thin-Film High-Speed Photonic Devices
Open AccessThis dissertation focuses on ultra-thin-film high-speed photonic devices that have emerged as promising technology for various applications, including telecommunications, data centers, and optoelectronic sensing. This abstract presents an overview of the integration and metrology techniques employed to enable the development and optimization of these advanced photonic devices.The integration of emerging materials plays a crucial role in the fabrication of ultra-thin-film photonic devices. These devices often rely on the integration of novel materials with unique optical and electronic properties, such as two-dimensional materials, quantum dots, transparent conductive oxides, or organic semiconductors. The successful integration of these materials requires careful consideration of compatibility, interface engineering, and deposition techniques to ensure high-performance device operation. Additionally, accurate metrology techniques are vital for the characterization and optimization of ultra-thin-film photonic devices. Metrology methods, including spectroscopic ellipsometry, atomic force microscopy, and scanning electron microscopy, enable the measurement of critical parameters such as film thickness, roughness, and composition. Furthermore, advanced metrology techniques such as photoluminescence spectroscopy and fabrication recipe optimization facilitate the investigation of optical properties, carrier dynamics, and device performance at ultra-fast timescales. This dissertation highlights recent advancements in material integration and metrology techniques specifically tailored for ultra-thin-film high-speed photonic devices. It discusses the challenges associated with integrating novel materials into device architectures, as well as the importance of accurate metrology for device characterization. Novel development of techniques and tools for material integration will explain the novel outcomes in the form of the development of various optoelectronic devices using two-dimensional materials, topological insulators, transparent conductive oxide, and more. Furthermore, it emphasizes the need for continuous innovation in integration techniques and metrology methodologies to overcome the limitations of traditional fabrication processes and unlock the full potential of ultra-thin-film photonic devices. The integration of emerging materials and the development of robust metrology techniques are crucial steps toward the realization of high-performance ultra-thin-film photonic devices. These advancements have the potential to revolutionize various industries, enabling faster communication networks, more efficient data processing, and highly sensitive optoelectronic sensing systems. Continued research and development in this field will drive further progress in the integration and metrology techniques, ultimately paving the way for the widespread adoption of ultra-thin-film high-speed photonic devices in numerous applications.
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